题目：Smart Materials: From Shape Memory Wrinkling to Self-healable and Recyclable Flexible Electronics
时间：2018年7月27日 10:00
地点：机械与动力工程学院 F207会议室
邀请人：汪华苗副教授（机电设计与知识工程研究所）
Biography
Jianliang Xiao is an Assistant Professor in the Department of Mechanical Engineering at University of 
Colorado Boulder. Before joining CU-Boulder, he was a Postdoctoral Research Associate in Prof. John Rogers' group at the Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign. He obtained his Ph.D. degree in Mechanical Engineering in 2009 from Northwestern University, under the supervision of Prof. Yonggang Huang. His B.S. and M.S. degrees were both from Tsinghua University in 2003 and 2006, respectively. His research interests include stretchable/flexible electronics, nanomaterials, soft materials and thin films.
Abstract
Smart materials possess properties that are superior to conventional materials. For example, some smart materials exhibit large deformation in responding to external stimuli, such as heat, PH value, electrical field, and humidity, and some smart materials could self-heal like human skin when cut broken. In the first part of this talk, Dr. Xiao will discuss surface wrinkling mechanics of shape memory polymers, with potential applications in smart electronics, tunable adhesion and unusual optics. In the second part, he will introduce our recent progress on self-healable, recyclable and malleable electronic skin based on dynamic covalent thermoset doped with conductive silver nanoparticles. Tactile, temperature, flow and humidity sensing capabilities were realized. The e-skin can be rehealed when it's damaged, and can be fully recycled at room temperature. After rehealing or recycling, the e-skin regains mechanical and electrical properties comparable to the original e-skin. In addition, malleability enables the e-skin to permanently conform to complex, curved surfaces without introducing excessive interfacial stresses. These properties of the e-skin yield an economical and eco-friendly technology that can find broad applications in robotics, prosthetics, healthcare and human-computer interface.
